Low-temperature lead-free SnBiIn solder for electronic packaging

Shannan Zhang, Weimin Long, Peiyan Li, Fuli Liu, Hangyan Xue, Tianran Ding

2024Journal of Materials Science Materials in Electronics17 citationsDOI

Topics & Concepts

Lead (geology)SolderingMaterials scienceElectronic packagingMetallurgyComposite materialGeologyGeomorphologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectromagnetic Compatibility and Noise Suppression