Study on Thermal Conductivity of P-Phenylenediamine Modified Graphene/Epoxy Composites
Jun Lin, Jiancheng Zhou, Mengyao Guo, Danqing Chen, Guohua Chen
Abstract
Thermal management has become an important requirement for many types of electrical equipment due to the development of integrated circuits. In this study, modified and reduced graphene fillers were synthesized in two steps, and then epoxy resin was filled through the evaporation of the solvent. The interfacial thermal resistance between the filler and matrix material was lowered by including amino groups to improve graphene compatibility in the epoxy resin. Furthermore, the reduction procedure was shown to have the potential to fix graphene oxide flaws, thereby improving thermal stability, electrical conductivity, and thermal conductivity of the composites. As a result, the thermal conductivity of the composite reached 1.7 W/mK, which is 750% higher than that of pure epoxy resin, and it was still insulated.