Multi-strategy preparation of para-aramid paper with high interfacial bond strength
Teng Fei, Na Li, Ying Yuan, Yutong Cao, Junrong Yu, Yan Wang, Zuming Hu
Topics & Concepts
Materials scienceAramidBond strengthComposite materialBondPolymer scienceAdhesiveBusinessLayer (electronics)FiberFinanceFiber-reinforced polymer compositesAdvanced Cellulose Research StudiesRecycling and Waste Management Techniques