Litcius/Paper detail

Introducing a novel heat sink comprising PCM and air - Adapted to electronic device thermal management

Rasool Kalbasi

2021International Journal of Heat and Mass Transfer243 citationsDOI

Topics & Concepts

Heat sinkMaterials scienceHeat transfer coefficientThermodynamicsAir coolingHeat transferPassive coolingHeat spreaderThermal resistanceConvectionSink (geography)MechanicsPhysicsCartographyGeographyPhase Change Materials ResearchSolar Thermal and Photovoltaic SystemsHeat Transfer and Optimization