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The superplastic forming/diffusion bonding and mechanical property of TA15 alloy for four‐layer hollow structure with squad grid

Zhihao Du, Kaifeng Zhang

2021International Journal of Material Forming13 citationsDOI

Topics & Concepts

SuperplasticityMaterials scienceLayer (electronics)AlloyDiffusion bondingDiffusionGridComposite materialGeometryThermodynamicsMathematicsPhysicsAluminum Alloy Microstructure PropertiesAluminum Alloys Composites PropertiesTitanium Alloys Microstructure and Properties
The superplastic forming/diffusion bonding and mechanical property of TA15 alloy for four‐layer hollow structure with squad grid | Litcius