Investigating the impact of cobalt incorporation on the transformation of Cu6Sn5 layer to (Cu, Co)6Sn5: Microstructural and mechanical insights
Xi Huang, liang zhang, Kai Deng, Lei Sun
Topics & Concepts
SolderingMaterials scienceIntermetallicSolderabilityLayer (electronics)MetallurgyCobaltShear strength (soil)Composite materialWettingSoil waterAlloySoil scienceEnvironmental scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis