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Asymmetric growth of Cu6Sn5 intermetallic compound in Cu/Sn/Cu interconnection system under the vertical ultrasonic vibration

Hongwei Niu, Hong Bian, Xiangdong Liu, Xiaoguo Song, Hongyun Zhao

2024Intermetallics11 citationsDOI

Topics & Concepts

IntermetallicMaterials scienceInterconnectionUltrasonic sensorVibrationMetallurgyCopperAcousticsComputer scienceAlloyPhysicsComputer networkElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis
Asymmetric growth of Cu6Sn5 intermetallic compound in Cu/Sn/Cu interconnection system under the vertical ultrasonic vibration | Litcius