A dual non-covalent bonding constructed continuous interfacial structure for reducing interfacial thermal resistance
Bin Wu, Ya Li, Wei Chen, Boyang Ding, Peng Chen, Ru Xia, Jiasheng Qian
Abstract
C-P3HT created a heat transfer “bridge” in adjacent graphene through dual non-covalent bonding, which achieved excellent in-plane thermal conductivity of composites.
Topics & Concepts
Covalent bondMaterials scienceThermal conductivityComposite materialThermal resistanceInterfacial thermal resistanceDual (grammatical number)ThermalGrapheneNanotechnologyChemistryThermodynamicsLiteratureOrganic chemistryPhysicsArtThermal properties of materialsGraphene research and applicationsComposite Material Mechanics