In-situ synergistic effect of Pr and Al2O3 nanoparticles on enhancing thermal cycling reliability of Sn-0.3Ag-0.7Cu/Cu solder joint
Jie Wu, Songbai Xue, Guoqiang Huang, Huabin Sun, Fengfeng Chi, Xiaolei Yang, Yong Xu
Topics & Concepts
Temperature cyclingSolderingIn situNanoparticleJoint (building)Materials scienceCyclingReliability (semiconductor)MetallurgyThermalComposite materialNanotechnologyChemistryStructural engineeringEngineeringThermodynamicsPower (physics)ArchaeologyHistoryOrganic chemistryPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties