Litcius/Paper detail

An additively manufactured manifold-microchannel heat sink for high-heat flux cooling

Daeyoung Kong, Euibeen Jung, Yunseo Kim, Vivek V. Manepalli, Kyupaeck Jeff Rah, Han Sang Kim, Yongtaek Hong, Hyoung Gil Choi, Damena Agonafer, Hyoungsoon Lee

2023International Journal of Mechanical Sciences64 citationsDOI

Topics & Concepts

MicrochannelMaterials scienceHeat sinkHeat fluxPressure dropHydraulic diameterThermal resistanceCoolantMechanicsComputer coolingMass flow rateThermodynamicsComposite materialHeat transferMechanical engineeringThermal management of electronic devices and systemsNanotechnologyReynolds numberEngineeringTurbulencePhysicsHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies