Mechanisms and characterization of a novel hybrid laser-enhanced particle laden electrochemical fabrication process for high quality micro-dimples on germanium wafers
Hao Zhu, Jincai Han, Jun Wang, Qinglin Zhang, Zhaoyang Zhang, Hao Yuan, Jinzhong Lu, Kun Xu, Yang Liu, Jingtao Wang
Topics & Concepts
Materials scienceDimpleWaferLaserParticle (ecology)MachiningSurface roughnessSemiconductorOptoelectronicsSiliconPassivationNanotechnologyComposite materialOpticsMetallurgyLayer (electronics)PhysicsGeologyOceanographyLaser Material Processing TechniquesAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization Techniques