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Stacking fault formation and Ag precipitation in Cu-Ag-Sc alloys

Bailing An, Yan Xin, Rongmei Niu, Zhaolong Xiang, Yi-Feng Su, Jun Lü, Engang Wang, Ke Han

2022Materials Characterization23 citationsDOI

Topics & Concepts

NucleationMaterials sciencePrecipitationGrain boundaryStacking faultAlloyCrystallographyStackingPlanarDislocationConductivityElectrical resistivity and conductivityPrecipitation hardeningMetallurgyComposite materialMicrostructureThermodynamicsPhysical chemistryChemistryComputer scienceMeteorologyPhysicsOrganic chemistryElectrical engineeringComputer graphics (images)EngineeringCopper Interconnects and ReliabilityElectronic Packaging and Soldering TechnologiesMicrostructure and mechanical properties
Stacking fault formation and Ag precipitation in Cu-Ag-Sc alloys | Litcius