Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites
Jing He, Hua Wang, Qiqi Qu, Zheng Su, Tengfei Qin, Yunsheng Da, Xingyou Tian
Topics & Concepts
Materials scienceEpoxyComposite materialThermal conductivitySilicon carbideGrapheneElectronic packagingThermal conductionNanotechnologyThermal properties of materialsGraphene research and applicationsHigh voltage insulation and dielectric phenomena