Enhanced reliability of Cu-Sn bonding through the microstructure evolution of nanotwinned copper
Xinyu Jin, Huahan Li, Yingying Sun, Zhiqin Chen, Peixin Chen, Hongwei Su, Ming Li, Yunwen Wu
Topics & Concepts
Materials scienceMicrostructureCopperMetallurgyReliability (semiconductor)ThermodynamicsPhysicsPower (physics)Electronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis