Synthesis and Properties of a Novel Thermally Conductive Pressure‐Sensitive Adhesive with UV‐Responsive Peelability
Xiaohua Cui, Jiaming Liu, Ending Zhang, Ziyang Gong, Liyan Liang, Jun Shi, Xiaopeng Hao, Jiwen Hu, Mangeng Lu
Abstract
Abstract Thermally conductive pressure‐sensitive adhesive (PSA) has received a great amount of attention in recent years, but the traditional PSA hardly loses adhesion properties after UV irradiation or heating. Therefore, endowing thermally conductive adhesive with UV‐responsive peelability becomes a design strategy. Herein, vinyl‐functionalized graphene (AA‐GMA‐G) is prepared by modifying graphene with acrylic acid and subsequently reacting with glycidyl methacrylate. Then, the UV‐curable acrylate copolymer is synthesized by grafting glycidyl methacrylate. Finally, the novel thermally conductivity PSA with UV‐responsive peelability is obtained by blending the copolymer with AA‐GMA‐G and photoinitiator. The results show that the PSA at 2 wt% AA‐GMA‐G loading exhibits an excellent thermal conductivity (0.74 W m −1 K −1 ) and a relatively strong peel strength, increasing by 15% compared with pristine graphene/PSA. Interestingly, the peel strength of AA‐GMA‐G/PSA can achieve a dramatic drop after UV treatment, and the decrease rate is 96.7%. Therefore, the novel thermally conductive PSA with UV‐responsive peelability has potential applications in certain electronic devices.