Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding
Pin-Syuan He, Chun-Wei Tu, Kai-Cheng Shie, Chien-Yu Liu, Hsin-Yu Tsai, Dinh-Phuc Tran, Chih Chen
Topics & Concepts
ChemistryChemical-mechanical planarizationPolyimideCopperMetallurgyPolymer chemistryOrganic chemistryLayer (electronics)Materials scienceAdvanced Surface Polishing Techniques3D IC and TSV technologiesCopper Interconnects and Reliability