Sliding moving contact problem between a rigid cylindrical punch and a functionally graded orthotropic layer bonded to an isotropic homogeneous layer
İsa Çömez
Abstract
In this study, moving contact problem for a rigid punch and a functionally graded orthotropic layer bonded to an isotropic homogeneous layer is solved, semi-analytically. The cylindrical punch moves steadily with a constant subsonic velocity over the upper layer and transmits concentrated normal and tangential forces. Using Fourier transform and Galilean transformation, the contact problem is converted to a Cauchy-type singular integral equation of the second kind, in which the contact stress and contact width are the unknowns. The numerical solution of the singular integral equation is obtained by using Gauss–Jacobi integration formulas. Numerical results for the contact stress, in-plane stress, and the contact width are given.
Topics & Concepts
Orthotropic materialIsotropyMathematical analysisContact mechanicsSingular integralMathematicsTransverse isotropyLayer (electronics)GeometryFourier transformMaterials scienceIntegral equationMechanicsComposite materialPhysicsFinite element methodStructural engineeringOpticsEngineeringMechanical stress and fatigue analysisContact Mechanics and Variational InequalitiesAdhesion, Friction, and Surface Interactions