A Comparison of CF4, CHF3 and C4F8 + Ar/O2 Inductively Coupled Plasmas for Dry Etching Applications
Nomin Lim, Alexander Efremov, Kwang‐Ho Kwon
Topics & Concepts
Etching (microfabrication)ChemistryIonPlasmaSputteringKineticsAnalytical Chemistry (journal)PolymerizationPolymerAtom (system on chip)OxygenFluorocarbonPlasma parametersPlasma modelingThin filmMaterials scienceNanotechnologyOrganic chemistryPhysicsComputer scienceLayer (electronics)Embedded systemQuantum mechanicsPlasma Diagnostics and ApplicationsMetal and Thin Film MechanicsSemiconductor materials and devices