Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature
Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hidetoshi Hirahara, Jing Sang, Sung hun Cho, Tohru Sekino, Katsuaki Suganuma
Topics & Concepts
EpoxyMaterials scienceComposite materialCopperX-ray photoelectron spectroscopyNanoindentationChemical engineeringMetallurgyEngineeringElectronic Packaging and Soldering TechnologiesHigh voltage insulation and dielectric phenomenaFiber-reinforced polymer composites