Effect of grain boundary engineering on grain boundary character distribution and deformation behavior of a TRIP-assisted high-entropy alloy
Zeyu You, Zihan Tang, J.P. Li, F.B. Chu, Hua Ding, R.D.K. Misra
Topics & Concepts
Materials scienceElectron backscatter diffractionUltimate tensile strengthGrain boundaryMetallurgyAlloyDeformation (meteorology)Tensile testingSlip (aerodynamics)Deformation mechanismPlasticityComposite materialMicrostructureThermodynamicsPhysicsHigh Entropy Alloys StudiesHigh-Temperature Coating BehaviorsMetal and Thin Film Mechanics