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In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process

Fei Qin, Lixiang Zhang, Pei Chen, Tong An, Yanwei Dai, Yanpeng Gong, Zhongbo Yi, Haiming Wang

2021Mechanical Systems and Signal Processing29 citationsDOI

Topics & Concepts

GrindingWaferMaterials scienceMachiningGrinding wheelMechanical engineeringProcess (computing)System of measurementComputer scienceEngineeringNanotechnologyComposite materialMetallurgyPhysicsOperating systemAstronomyAdvanced machining processes and optimizationAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization Techniques
In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process | Litcius