Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
Joshua Adeniyi Depiver, Sabuj Mallik, Emeka H. Amalu
Topics & Concepts
Ball grid arraySolderingMaterials scienceCreepTemperature cyclingEutectic systemMetallurgyComposite materialStructural engineeringAlloyThermalEngineeringPhysicsMeteorologyElectronic Packaging and Soldering TechnologiesHigh Temperature Alloys and CreepAluminum Alloy Microstructure Properties