A new semi-analytical prediction model for temperature field of ultrasonic vibration grinding of single abrasive particles
Runxiang Zou, Jun Wen, Jinyuan Tang, Weihua Zhou, Yuhui He
Topics & Concepts
AbrasiveGrindingMaterials scienceUltrasonic sensorVibrationThermal conductionHeat transferField (mathematics)Mechanical engineeringMechanicsFinite element methodHeat generationAcousticsStructural engineeringEngineeringComposite materialPhysicsThermodynamicsMathematicsPure mathematicsAdvanced machining processes and optimizationAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization Techniques