High Resolution Aerosol Jet Printed Components with Electrodeposition-Enhanced Conductance
Lok‐kun Tsui, Ste-ven Chase Kayser, Samuel A. Strong, Judith Maria Lavin
Abstract
Aerosol Jet Printing (AJP) is one technique of additive manufacturing used in the printing of electronics components. AJP enables the patterning of features at the ∼10 μ m–100 μ m scale based on hardware and print parameters. Optimization of print conditions enables the printing of high-resolution features with linewidths approaching 10 μ m. The aerosol jet printing of electronic parts can be limited by the conductivities which are achievable by Ag nanoparticle inks (typically 15%–25% of bulk Ag). For certain electronics applications, the increased conductivity produces unacceptable loses during operation and methods are needed to increase the conductance of the devices without sacrificing resolution. Here, we report on the AJP of inductor spirals conductor traces of linewidth 50 μ m separated by 55 μ m gaps. The conductivity of these features is enhanced by electrodeposition of Cu onto the Ag, resulting in a decrease in resistance of 35–45x. Impedance measurements demonstrate that the addition of Cu by electrodeposition to a 27-turn spiral inductor resulted in an inductance of 3.6 μ H. Finally, we demonstrate the use of a lift-off process to produce free-standing, flexible, conductive films using AJP.