Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD

Xiaoguang Guo, Song Yuan, Yongjun Gou, Xiaoli Wang, Jiang Guo, Zhuji Jin, Renke Kang

2020Applied Surface Science55 citationsDOI

Topics & Concepts

CopperChemical-mechanical planarizationAqueous solutionReaxFFAdsorptionChemistrySlurryInorganic chemistryDissociation (chemistry)PolishingMaterials scienceMoleculeMetallurgyPhysical chemistryOrganic chemistryHydrogen bondComposite materialAdvanced Surface Polishing TechniquesAdvanced materials and compositesAdvanced machining processes and optimization