Litcius/Paper detail

Design of a disulfide bond-containing photoresist with extremely low volume shrinkage and excellent degradation ability for UV-nanoimprinting lithography

Mingliang Zhang, Shengling Jiang, Yanjing Gao, Jun Nie, Fang Sun

2020Chemical Engineering Journal38 citationsDOI

Topics & Concepts

PhotoresistMaterials scienceNanoimprint lithographyLithographyPolymerizationResistShrinkagePolymerAcrylateChemical engineeringComposite materialPolymer chemistryOptoelectronicsCopolymerFabricationEngineeringPathologyAlternative medicineMedicineLayer (electronics)Nanofabrication and Lithography TechniquesAdvancements in Photolithography TechniquesNanomaterials and Printing Technologies
Design of a disulfide bond-containing photoresist with extremely low volume shrinkage and excellent degradation ability for UV-nanoimprinting lithography | Litcius