Correlation between crystallographic texture and electrochemical behavior of nano/ultrafine-grained AA2024 alloy processed by accumulative roll bonding process
Majid Naseri, Ehsan Borhani, Omid Imantalab, Ho Won Jang, Mohammadreza Shokouhimehr, Arash Fattah‐alhosseini
Abstract
This study provides an insight into the correlation between crystallographic texture and electrochemical behavior of nano/ultrafine-grained AA2024 alloy. To achieve this objective, the following AA2024 alloys were processed by accumulative roll bonding (ARB): (i) Nano/ultrafine-grained AA2024 alloy with virtually the same grain size and the texture components of S {123}⟨634⟩, Cube {001}⟨100⟩, Copper {112}⟨111⟩, and Brass {011}⟨211⟩, and (ii) Bimodal-grained structure AA2024 alloy consisting of coarse and ultrafine elongated grains and the texture components of S {123}⟨634⟩ and Brass {011}⟨211⟩. The results indicated that the grain refinement increases the corrosion current density and decreases the passive film resistance of AA2024 alloy in quiescent phosphate buffer solution (pH = 9). Overall, electrochemical studies revealed that the uniform distribution of grain size and development of Cube {001}⟨100⟩ and Copper {112}⟨111⟩ texture components provide the most advantageous electrochemical properties. Hence, it was suggested that nano/ultrafine-grained structure was preferred compared to bimodal grain structure.