Springback behaviors of extruded 6063 aluminum profile in subsequent multi-stage manufacturing processes
Zhiwen Liu, Luoxing Li, Guan Wang, Jingran Chen, Jie YI
Topics & Concepts
BendingMaterials scienceBent molecular geometryResidual stressAluminiumDie (integrated circuit)Composite materialExtrusionStructural engineeringProcess (computing)EngineeringOperating systemComputer scienceNanotechnologyMetal Forming Simulation TechniquesAluminum Alloy Microstructure PropertiesMetallurgy and Material Forming