Three-dimensional numerical simulation of heat transfer enhancement of electronic devices by single crystal diamond rhombus-shaped pin fin microchannel heat sink
Jin Yuan, Yongfeng Qu, Ningkang Deng, Liang Du, Wenbo Hu, Xiaofan Zhang, Shengli Wu, Hongxing Wang
Topics & Concepts
Heat sinkRhombusHeat transferMaterials scienceThermal resistanceFinMicro heat exchangerMechanicsDiamondThermal conductivityHeat spreaderHeat transfer coefficientMicrochannelThermodynamicsComposite materialNanotechnologyGeometryPhysicsMathematicsHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies