A Review: Effect of Nanoparticle Additions on the Physical, Microstructural, Interfacial and Mechanical Properties of Low Temperature SnBi Solder Alloys
Amares Singh, Hui Leng Choo, Wei Tan, R. Durairaj, Shamini Janasekaran, M. Saravanan
Topics & Concepts
Materials scienceSolderingNanoparticleMetallurgyComposite materialNanotechnologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties