Prediction model for surface shape of YAG wafers in wafer rotational grinding
Jinxing Huang, Renke Kang, Zhigang Dong, Shang Gao
Topics & Concepts
WaferGrindingMaterials scienceSurface (topology)Rotational speedComposite materialOpticsMechanical engineeringOptoelectronicsEngineeringGeometryPhysicsMathematicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques