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Multiscale analysis of the effect of interfacial thermal conductance between fillers and epoxy resin on the effective thermal conductivity of their composites

Can Sheng, Kang Liang, Gai Wu, Fang Dong, Yuzheng Guo, Sheng Liu

2022Diamond and Related Materials11 citationsDOI

Topics & Concepts

EpoxyMaterials scienceComposite materialThermal conductivityThermosetting polymerDiglycidyl etherComposite numberThermal conductionMolding (decorative)Compression moldingBisphenol AMoldThermal properties of materialsTribology and Wear AnalysisComposite Material Mechanics
Multiscale analysis of the effect of interfacial thermal conductance between fillers and epoxy resin on the effective thermal conductivity of their composites | Litcius