In-situ growth of diamond/Ag as hybrid filler for enhancing thermal conductivity of liquid crystal epoxy
Zeyu Zheng, Hui Xu, Jialin Wen, Jifeng Chen, Zhu Mao, Pengli Zhu, Rong Sun, Weijing Wu, Junbiao Peng
Topics & Concepts
Materials scienceEpoxyComposite materialComposite numberThermal conductivityFiller (materials)DiamondNanocompositeThermal expansionMicrostructureCuring (chemistry)Thermal properties of materialsTribology and Wear AnalysisPolymer Nanocomposites and Properties