Alloying regulation mechanism toward microstructure evolution of Sn-bi-based solder joint under current stress
Zhuangzhuang Hou, Xiuchen Zhao, Yong Wang, Yue Gu, Chengwen Tan, Xiaochen Xie, Yongjun Huo, Ying Liu
Topics & Concepts
SolderingMaterials scienceIntermetallicElectromigrationMicrostructureJoint (building)MetallurgyStress (linguistics)Phase (matter)AlloyComposite materialStructural engineeringChemistryPhilosophyLinguisticsEngineeringOrganic chemistryElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesSemiconductor materials and interfaces