Formation mechanism and microstructure evolution of Cu/Ti diffusion bonding interface and its influence on joint properties
Yanni Wei, Linghao Zhu, Yaru Li, Yu Chen, Bingbing Guo
Topics & Concepts
MicrostructureMaterials scienceIntermetallicDiffusion bondingJoint (building)Shear strength (soil)Composite materialDiffusionResidual stressIndentation hardnessPhase (matter)MetallurgyTitaniumShear (geology)ThermodynamicsChemistryStructural engineeringAlloySoil sciencePhysicsEnvironmental scienceOrganic chemistrySoil waterEngineeringAluminum Alloys Composites PropertiesAdvanced Welding Techniques AnalysisMicrostructure and mechanical properties