Microstructural transformation and mechanical properties of Cu-sputtered alumina ceramic/Zn5Al/AA2024 ultrasonic soldering joints
Zhengwu Zhou, Haijun Li, Chao Chen
Topics & Concepts
Materials scienceEutectic systemSolderingCeramicMetallurgyComposite materialAlloyShear strength (soil)Residual stressSputteringThin filmSoil waterEnvironmental scienceSoil scienceNanotechnologyAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesisAdvanced Welding Techniques Analysis