The microstructural and stress evolution in sputter deposited Ni thin films
Thomas R. Koenig, Zhaoxia Rao, Eric Chason, Garritt J. Tucker, Gregory B. Thompson
Topics & Concepts
Materials scienceSputteringThin filmSputter depositionGrain sizeStress (linguistics)Substrate (aquarium)Composite materialGrain growthUltimate tensile strengthGrain boundaryWaferContext (archaeology)MetallurgyDeposition (geology)MicrostructureNanotechnologyLinguisticsPaleontologySedimentGeologyOceanographyBiologyPhilosophyMetal and Thin Film MechanicsCopper Interconnects and ReliabilityHigh-Temperature Coating Behaviors