Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability
F. Arabi, A. Guédon-Gracia, Jean-Yves Delétage, H. Frémont
Topics & Concepts
Quad Flat No-leads packageVibrationTemperature cyclingPrinted circuit boardSolderingMaterials scienceRandom vibrationPower cyclingStructural engineeringThermalComposite materialReliability (semiconductor)EngineeringAcousticsPower (physics)Electrical engineeringAdhesivePhysicsQuantum mechanicsMeteorologyLayer (electronics)Electronic Packaging and Soldering Technologies3D IC and TSV technologiesMaterial Properties and Processing