Grain growth in pulse reverse electrodeposited copper foil: Contrasting effects of duty cycle during deposition and annealing
Akanksha R. Urade, K. N. Chaithanya Kumar, Narasimha Vinod Pulagara, Indranil Lahiri, K.S. Suresh
Topics & Concepts
Materials scienceAnnealing (glass)Duty cycleGrain sizeCrystal twinningCopperFOIL methodCrystalliteMetallurgyGrain growthGrain boundaryAnodeMicrostructureComposite materialElectrodeVoltageElectrical engineeringChemistryEngineeringPhysical chemistryElectrodeposition and Electroless CoatingsSemiconductor materials and interfacesElectronic Packaging and Soldering Technologies