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Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints

Young-Jin Seo, Jeong‐Won Yoon

2022Journal of Materials Science Materials in Electronics18 citationsDOI

Topics & Concepts

SolderingMaterials scienceMicrostructureJoint (building)Composite materialIntermetallicDirect shear testShear strength (soil)Reflow solderingSolderabilityMetallurgyMiniaturizationShear (geology)AlloyStructural engineeringEngineeringSoil waterSoil scienceEnvironmental scienceNanotechnologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties
Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints | Litcius