3D Integrated Process and Hybrid Bonding of High Bandwidth Memory (HBM)
Chae Yeon Lee, Chae Ho Won, Seyeon Jung, Eun Su Jung, Tae Min Choi, Hwa Rim Lee, JinUk Yoo, Songhun Yoon, Sung Gyu Pyo
Topics & Concepts
Materials scienceBandwidth (computing)Process (computing)OptoelectronicsProcess engineeringElectronic engineeringComputer scienceTelecommunicationsEngineeringOperating system3D IC and TSV technologiesAdditive Manufacturing and 3D Printing TechnologiesElectronic Packaging and Soldering Technologies