Characterization of plastic and creep behavior in thick aluminum wire for power modules
Nobuyuki SHISHIDO, Yoshiki Setoguchi, Yuto Kumagai, Masaaki KOGANEMARU, Tōru IKEDA, Yutaka HAYAMA, Noriyuki MIYAZAKI
Topics & Concepts
Materials scienceCreepWire bondingConstitutive equationStructural engineeringStress (linguistics)Isothermal processAluminiumDisplacement (psychology)Composite materialReliability (semiconductor)Strain energy density functionFracture (geology)Finite element methodPower (physics)EngineeringThermodynamicsElectrical engineeringChipPhysicsPsychotherapistPhilosophyPsychologyLinguisticsSilicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties