Enhancement of bonding strength in BiTe-based thermoelectric modules by electroless nickel, electroless palladium, and immersion gold surface modification
Yen Ngoc Nguyen, Subin Kim, Sung Hwa Bae, Injoon Son
Topics & Concepts
Materials scienceMetallurgySolderingBrittlenessIntermetallicBonding strengthPalladiumNickelWettingPlating (geology)Composite materialAlloyGeophysicsChemistryCatalysisGeologyBiochemistryAdvanced Thermoelectric Materials and DevicesThermal Radiation and Cooling TechnologiesElectronic Packaging and Soldering Technologies