Litcius/Paper detail

Gap filling mechanisms during the thin ply Automated Tape Placement process

Navid Niknafs Kermani, Verena Gargitter, Pavel Šimáček, Suresh G. Advani

2021Composites Part A Applied Science and Manufacturing23 citationsDOI

Topics & Concepts

WavinessMaterials scienceComposite materialProcess (computing)Head (geology)CompactionDeformation (meteorology)Engineering drawingMechanical engineeringComputer scienceEngineeringGeomorphologyGeologyOperating systemEpoxy Resin Curing ProcessesAdditive Manufacturing and 3D Printing TechnologiesMechanical Behavior of Composites
Gap filling mechanisms during the thin ply Automated Tape Placement process | Litcius