Determination of failure envelope of functionally graded adhesive bonded joints by using mixed mode continuum damage model and response surface method
Myong‐Ho Kim, Hyon‐Sik Hong, Yong-Chol Kim
Topics & Concepts
AdhesiveMaterials scienceLap jointFinite element methodComposite materialStructural engineeringJoint (building)Failure mode and effects analysisMaterial propertiesLayer (electronics)EngineeringMechanical Behavior of CompositesStructural Behavior of Reinforced ConcreteComposite Structure Analysis and Optimization