A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics
Mekala Bharath Krupa Teja, Ashutosh Sharma, Siddhartha Das, Karabi Das
Topics & Concepts
Materials scienceSolderingIntermetallicMicroelectronicsMetallurgyMicrostructureCeramicAlloyBrittlenessCastingNanotechnologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties