Molecular dynamics study on the temperature effect on shear failure of epoxy adhesive
Hao Zhang, Xiaocheng Chu, Guoqing Wang, Qingjun Ding, Gai Zhao, Lin Yang
Topics & Concepts
Materials scienceEpoxyAdhesiveComposite materialMolecular dynamicsShear (geology)Epoxy adhesiveComputational chemistryLayer (electronics)ChemistryMechanical Behavior of CompositesEpoxy Resin Curing ProcessesFiber-reinforced polymer composites