Litcius/Paper detail

Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds

Mohammad A. Gharaibeh, Jürgen Wilde

2024Microelectronics Reliability14 citationsDOI

Topics & Concepts

CreepMaterials scienceConstitutive equationViscoplasticityTinTransient (computer programming)Finite element methodComposite materialStress (linguistics)Phase (matter)Structural engineeringMetallurgyEngineeringComputer sciencePhilosophyOrganic chemistryOperating systemLinguisticsChemistryElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesMechanical stress and fatigue analysis