Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging
Quan‐Zhen Li, Chengming Li, Xiaojing Wang, Shanshan Cai, Jubo Peng, Shujin Chen, Jiajun Wang, Xiaohong Yuan
Topics & Concepts
Materials scienceMicrostructureSolderingIntermetallicIsothermal processComposite materialEutectic systemShear strength (soil)Joint (building)DopingShear (geology)AlloyMetallurgyThermodynamicsStructural engineeringOptoelectronicsPhysicsEngineeringSoil scienceSoil waterEnvironmental scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies