Perspective—Recent Advances and Thoughts on Ceria Particle Applications in Chemical Mechanical Planarization
Jihoon Seo, Kijung Kim, Hyun-Goo Kang, S. V. Babu
Abstract
Along with the remarkable growth in the complexity of semiconductor fabrication technology, chemical mechanical planarization (CMP) has evolved and become progressively more sophisticated over the years, enabling the implementation of novel integration schemes. This paper discusses current research and development trends in one specific aspect of the CMP technology, namely, ceria particle usage for advanced technology nodes and provides some perspectives on how to improve CMP performance metrics of the current ceria abrasives and ceria-based CMP slurries and move forward to the next phase.
Topics & Concepts
Chemical-mechanical planarizationMaterials scienceNanotechnologySlurryFabricationParticle (ecology)Engineering physicsEngineeringComposite materialOceanographyPathologyAlternative medicineMedicineGeologyLayer (electronics)Advanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchSemiconductor materials and devices